Micron Memory Part Number Decoder !!hot!!

Micron explicitly provides a web-based tool called the "FBGA and Component Marking Decoder" to handle this mapping. Engineers refer to this tool for a quick conversion of an FBGA code or to find the marking for a full part number. By entering the 5‑digit FBGA code, the tool returns the corresponding full part number. Conversely, inputting a full or partial part number will return the associated FBGA code(s).

The trailing letter ( E ) indicates the specific timing table (CL, tRCD, tRP).

Directly following "MT" are the characters indicating the specific class of memory. : DDR4 SDRAM 60B : DDR5 SDRAM 41K : DDR3L SDRAM (Low Voltage 1.35V) 46V : DDR1 SDRAM 47H : DDR2 SDRAM 53D : LPDDR4 / LPDDR4X Mobile RAM 62M : LPDDR5 Mobile RAM 3. Configuration and Density

This segment defines the total capacity of the individual memory die: : 256 Megabits 512M : 512 Megabits 1G : 1 Gigabit 2G : 2 Gigabits 4G : 4 Gigabits 8G : 8 Gigabits 16G : 16 Gigabits 32G : 32 Gigabits 5. Bit Configuration / Width (8) micron memory part number decoder

A typical Micron commercial part number consists of several distinct sections, usually looking something like this fictional example: .

: QLC (Quad-Level Cell) — High density, value consumer grade. 5. Operating Voltage (B) B : 3.3V A : 1.8V 🛠️ Summary Cheat Sheet Code Segment What it Means Prefix Micron Technology Generation 40 = DDR4/DDR5 | 62 = LPDDR5 Density Total chip capacity in Gigabits Width x8 or x16 data bus configuration Speed Performance rating (e.g., DDR4-3200) Revision Manufacturing die stepping

) is almost never the actual part number. To find the full specifications, you have to "translate" that code first. Step 1: Find the 5-Digit FBGA Code Micron explicitly provides a web-based tool called the

These letters define the physical layout, casing, and ball count of the chip.

: Indicates the generation of the silicon die (Die Rev A, B, or E). Later revisions often fix bugs or consume less power. WT : Wireless Temperature range (typically -30∘Cnegative 30 raised to the composed with power C +85∘Cpositive 85 raised to the composed with power C IT : Industrial Temperature range (highly durable, -40∘Cnegative 40 raised to the composed with power C +95∘Cpositive 95 raised to the composed with power C AT : Automotive Temperature range (maximum ruggedness, -40∘Cnegative 40 raised to the composed with power C +105∘Cpositive 105 raised to the composed with power C Micron FBGA Decoding vs. Component Part Numbers

The Micron Memory Part Number Decoder offers several benefits to users: Conversely, inputting a full or partial part number

On smaller memory chips, there is not enough physical surface area to print the full 12 to 18-character part number. To solve this, Micron prints a , known as the FBGA code .

Micron's non-volatile memory (NAND Flash and Solid State Storage components) uses a slightly different alphanumeric matrix to account for flash-specific variables like cell types and interface options.

| Code | Description | | :--- | :--- | | | Unbuffered DIMM (UDIMM) | | ASF | Micro-DIMM | | ATF | SODIMM (Laptop memory) | | ASV | Very Low Profile (VLP) RDIMM |

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